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 FDP5680/FDB5680
July 2000
FDP5680/FDB5680
General Description
60V N-Channel PowerTrenchTM MOSFET
Features
40 A, 60 V. RDS(ON) = 0.020 @ VGS = 10 V RDS(ON) = 0.023 @ VGS = 6 V. Critical DC electrical parameters specified at evevated temperature. Rugged internal source-drain diode can eliminate the need for an external Zener diode transient suppressor. High performance trend technology for extremely low RDS(ON). 175C maximum junction temperature rating. This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. These MOSFETs feature faster switching and lower gate charge than other MOSFETs with comparable R DS(on) specifications resulting in DC/DC power supply designs with higher overall efficiency.
D
D
G
G
D
TO-220 S
FDP Series
G S
TC = 25C unless otherwise noted
TO-263AB
FDB Series
S
Absolute Maximum Ratings
Symbol
VDSS VGSS ID PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Maximum Drain Current
Parameter
FDP5680
60 20 40 120 65 0.43
FDB5680
Units
V V A W W/C C
- Continuous - Pulsed
Total Power Dissipation @ TC = 25C Derate above 25C Operating and Storage Junction Temperature Range
-65 to +175
Thermal Characteristics
RJC RJA Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient 2.3 62.5 C/W C/W
Package Marking and Ordering Information
Device Marking
FDB5680 FDP5680
Device
FDB5680 FDP5680
Reel Size
13'' Tube
Tape Width
24mm N/A
Quantity
800 45
2000 Fairchild Semiconductor International
FDP5680/FDB5680 Rev. C
FDP5680/FDB5680
Electrical Characteristics
Symbol
WDSS IAR
Tc = 25C unless otherwise noted
Parameter
(Note1)
Test Conditions
Min
Typ
Max
90 40
Units
mJ A
Drain-Source Avalanche Ratings
Single Pulse Drain-Source VDD = 30 V, ID = 40A Avalanche Energy Maximum Drain-Source Avalanche Current
Off Characteristics
BVDSS BVDSS T J IDSS IGSSF IGSSR Drain-Source Breakdown Voltage VGS = 0 V, ID = -250 A Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse
(Note 1)
60 60 1 100 -100
V mV/C A nA nA
ID = -250 A, Referenced to 25C VDS = 48 V, VGS = 0 V VGS = 20 V, VDS = 0 V VGS = -20 V, VDS = 0 V
On Characteristics
VGS(th) VGS(th) T J RDS(on)
Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance
VDS = VGS, ID = 250 A ID = -250 A, Referenced to 25C VGS = 10 V, ID = 20 A, VGS = 10 V, ID = 20 A,TJ = 125C VGS = 6 V, ID = 19 A VGS = 10 V, VDS = 5 V VDS = 5 V, ID = 20 A
2
2.5 -6.4 0.016 0.022 0.018
4
V mV/C
0.020 0.035 0.023
ID(on) gFS
20 43
A S
Dynamic Characteristics
Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance
(Note 1)
VDS = 25 V, VGS = 0 V, f = 1.0 MHz
1850 230 95
pF pF pF
Switching Characteristics
td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD = 30 V, ID = 1 A, VGS = 10 V, RGEN = 6
15 9 35 16
27 18 56 26 46
ns ns ns ns nC nC nC
VDS = 30 V, ID = 20 A VGS = 10 V
33 6.5 7.5
Drain-Source Diode Characteristics and Maximum Ratings
IS VSD Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage VGS = 0 V, IS = 20 A
(Note 1) (Note 1)
40 0.9 1.2
A V
Note: 1. Pulse Test: Pulse Width 300 s, Duty Cycle 2.0%
FDP5680/FDB5680 Rev. C
FDP5680/FDB5680
Typical Characteristics
80 70 60 50 40 30 20 10 0 0 1 2 3 4 VDS, DRAIN-SOURCE VOLTAGE (V) 4.0V 4.5V
2.2
RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE
ID, DRAIN-SOURCE CURRENT (A)
VGS = 10V 6.0V 5.0V
2 1.8 1.6 1.4 1.2 1 0.8 0 10 20 30 40 50 60 70 80 ID, DRAIN CURRENT (A) VGS = 4.0V
4.5V 5.0V 6.0V 7.0V 10V
Figure 1. On-Region Characteristics.
2
0.05
Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.
ID = 20A
0.04
RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE
1.6 1.4 1.2 1 0.8 0.6 0.4 -50
RDS(ON), ON-RESISTANCE (OHM)
1.8
ID = 20A VGS = 10V
0.03
TA = 125oC
0.02
TA = 25oC
0.01
-25
0
25
50
75
100
o
125
150
0 3 4 5 6 7 8 9 10 VGS, GATE TO SOURCE VOLTAGE (V)
TJ, JUNCTION TEMPERATURE ( C)
Figure 3. On-Resistance Variation with Temperature.
60 50 25oC 125 C 40 30 20 10 0 2 3 4 5 6 VGS, GATE TO SOURCE VOLTAGE (V)
o
Figure 4. On-Resistance Variation with Gate-to-Source Voltage.
100
IS, REVERSE DRAIN CURRENT (A)
VDS = 5V
TA = -55 C
o
VGS = 0V 10 TA = 125 C 1 25 C 0.1 0.01 0.001 0.0001 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VSD, BODY DIODE FORWARD VOLTAGE (V) -55 C
o o o
ID, DRAIN CURRENT (A)
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.
FDP5680/FDB5680 Rev. C
FDP5680/FDB5680
Typical Characteristics
10 VGS, GATE-SOURCE VOLTAGE (V) ID = 20A 8
(continued)
2500
VDS = 10V 30V
20V
2000
CAPACITANCE (pF)
f = 1MHz VGS = 0 V CISS
6
1500
4
1000
2
500 COSS CRSS
0 0 5 10 15 20 25 30 35 Qg, GATE CHARGE (nC)
0 0 10 20 30 40 50 60 VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate-Charge Characteristics.
1000
Figure 8. Capacitance Characteristics.
1500 SINGLE PULSE o RJC = 2.3 C/W TC = 25 C
POWER (W)
o
ID DRAIN CURRENT (A)
100
1ms RDS(ON) LIMIT 1s 10s DC VGS = 10V SINGLE PULSE RJC = 2.3oC/W TC = 25 C
o
1200
10ms 100ms
900
10
600
1
300
0.1 0.1 1 10 100
0 0.0001
0.001
0.01
0.1
1
10
VDS, DRAIN-SOURCE VOLTAGE (V)
SINGLE PULSE TIME (SEC)
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum Power Dissipation.
1
TRANSIENT THERMAL RESISTANCE
0.5 0.3
D = 0.5
(t), NORMALIZED EFFECTIVE
0.2
R JC (t) = r(t) * RJC R JC =2.3 C/W
P(pk)
0.2
0.1
0.1
0.05 0.02
t1
t2
0.05 0.03 0.1
Single Pulse
TJ - TC = P * RJC (t) Duty Cycle, D = t1 /t2
10 t 1 ,TIME (ms) 100 1000 3000 10000
r
0.5
1
Figure 11. Transient Thermal Response Curve.
FDP5680/FDB5680 Rev. C
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM BottomlessTM CoolFETTM CROSSVOLTTM E2CMOSTM FACTTM FACT Quiet SeriesTM FAST FASTrTM GTOTM
DISCLAIMER
HiSeCTM ISOPLANARTM MICROWIRETM POPTM PowerTrench QFETTM QSTM Quiet SeriesTM SuperSOTTM-3 SuperSOTTM-6
SuperSOTTM-8 SyncFETTM TinyLogicTM UHCTM VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or 2. A critical component is any component of a life support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. E


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